低温制冷团队动态

美国佐治亚理工学院Satish Kumar学术讲座通知


2016-05-14

 

     应制冷及低温工程系侯予教授、陈良博士邀请,美国佐治亚理工学院Satish Kumar副教授将于5月15日至5月21日来访我校交流。来访期间将做“纳米材料结构热传导微观机理及电子器件应用研究”系列学术讲座,欢迎感兴趣的老师和学生积极参加。

       报告安排如下:

 

时间
地点
报告题目
516日,下午
16:00 18:00
北二楼1411
Thermal Transport in Nano-Structures and Electronic Devices
517日,上午
10:00 12:00
东三楼东汽报告厅
Micro-nano Scale Heat Transport: Theory and Applications
518日,下午
14:30 16:30
东三楼东汽报告厅
Atomistic Simulations and Experimental Techniques for Thermal Property Analysis
  

 

报告人简介

     Satish Kumar博士是佐治亚理工学院机械工程系副教授,学校教学发展中心委员,ASME K-16和K-9委员会委员。Kumar博士已在国际学术期刊和学术会议上发表论文80余篇,并获多项表彰奖励,例如Sigma Xi 杰出青年奖和DARPA(美国国防高级研究计划局)杰出青年奖。Kumar博士课题组研究主要集中在微纳米尺度传热数值与实验研究、新型纳米导热材料应用、电子器件传热分析等领域,相关研究项目获美国国家自然科学基金(NSF)、美国海军研究中心(ONR)、美国国防高级研究计划局(DARPA)、美国橡树岭国家实验室(ORNL)和半导体研究公司(SRC)等机构支持。

 

Biograph

      Dr. Satish Kumar is currently Associate Professor in George W. Woodruff School of Mechanical Engineering at Georgia Tech. He joined Georgia Tech in 2009 as an Assistant Professor. Prior to Georgia Tech, he worked at IBM Corporation where he was responsible for the thermal management of electronic devices. Kumar received his Ph.D. in Mechanical Engineering and M.S. degree in Electrical and Computer Engineering from Purdue University, West Lafayette in 2007; and B.Tech. degree in Mechanical Engineering from the Indian Institute of Technology, Guwahati in 2001. His research interests are in thermal management, atomistic transport models for nano-structures, flexible-electronics and thermo-electric coolers. He is author or co-author of over 75 journal or conference publications. Dr. Kumar is recipient of Purdue Research Foundation Fellowship in 2005, 1969 Teaching Fellow from Center for the Enhancement of Teaching and Learning Center at Georgia Tech, 2012 Summer Faculty Fellow from Air Force Research Lab, 2014 Sigma Xi Young Faculty Award, and 2014 DARPA Young Faculty Award. His research has been supported by grants from National Science Foundation (NSF), Office of Naval Research (ONR), Defense Advanced Research Projects Agency (DARPA), Oak Ridge National Lab (ORNL), and Semiconductor Research Corporation (SRC).